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Электронный компонент: AP4563GM

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Advanced Power
N AND P-CHANNEL ENHANCEMENT
Electronics Corp.
MODE POWER MOSFET
Simple Drive Requirement
N-CH BV
DSS
40V
Fast Switching Performance
R
DS(ON)
30m
RoHS Compliant
I
D
6.7A
P-CH BV
DSS
-40V
R
DS(ON)
36m
Description
I
D
-6A
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
N-channel
P-channel
V
DS
Drain-Source Voltage
40
-40
V
V
GS
Gate-Source Voltage
20
20
V
I
D
@T
A
=25
Continuous Drain Current
3
6.7
-6
A
I
D
@T
A
=70
Continuous Drain Current
3
5.3
-4.8
A
I
DM
Pulsed Drain Current
1
50
-50
A
P
D
@T
A
=25
Total Power Dissipation
2
W
Linear Derating Factor
0.016
W/
T
STG
Storage Temperature Range
-55 to 150
T
J
Operating Junction Temperature Range
-55 to 150
Symbol
Value
Unit
Rthj-a
Thermal Resistance Junction-ambient
3
Max.
62.5
/W
Data and specifications subject to change without notice
Parameter
200617051-1/7
Thermal Data
AP4563GM
Pb Free Plating Product
G2
D2
S2
G1
D1
S1
S1
G1
S2
G2
D1
D1
D2
D2
SO-8
The Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-
effectiveness.
The SO-8 package is universally preferred for all commercial-
industrial surface mount applications and suited for low voltage
applications such as DC/DC converters.
N-CH Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ. Max. Units
BV
DSS
Drain-Source Breakdown Voltage
V
GS
=0V, I
D
=250uA
40
-
-
V
B
V
DSS
/T
j
Breakdown Voltage Temperature Coefficient
Reference to 25
, I
D
=1mA
-
0.03
-
V/
R
DS(ON)
Static Drain-Source On-Resistance
2
V
GS
=10V, I
D
=6A
-
-
30
m
V
GS
=4.5V, I
D
=4A
-
-
40
m
V
GS(th)
Gate Threshold Voltage
V
DS
=V
GS
, I
D
=250uA
1
-
3
V
g
fs
Forward Transconductance
V
DS
=10V, I
D
=6A
-
9
-
S
I
DSS
Drain-Source Leakage Current (T
j
=25
o
C)
V
DS
=40V, V
GS
=0V
-
-
1
uA
Drain-Source Leakage Current (T
j
=70
o
C)
V
DS
=32V, V
GS
=0V
-
-
25
uA
I
GSS
Gate-Source Leakage
V
GS
=20V
-
-
100
nA
Q
g
Total Gate Charge
2
I
D
=6A
-
10
16
nC
Q
gs
Gate-Source Charge
V
DS
=30V
-
4
-
nC
Q
gd
Gate-Drain ("Miller") Charge
V
GS
=4.5V
-
5
-
nC
t
d(on)
Turn-on Delay Time
2
V
DS
=20V
-
10
-
ns
t
r
Rise Time
I
D
=1A
-
5
-
ns
t
d(off)
Turn-off Delay Time
R
G
=3.3
,
V
GS
=10V
-
23
-
ns
t
f
Fall Time
R
D
=20
-
7
-
ns
C
iss
Input Capacitance
V
GS
=0V
-
1100 1760
pF
C
oss
Output Capacitance
V
DS
=25V
-
165
-
pF
C
rss
Reverse Transfer Capacitance
f=1.0MHz
-
90
-
pF
R
g
Gate Resistance
f=1.0MHz
-
1.8
2.7
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min.
Typ. Max. Units
V
SD
Forward On Voltage
2
I
S
=6A, V
GS
=0V
-
-
1.3
V
t
rr
Reverse Recovery Time
I
S
=6A, V
GS
=0V
-
21
-
ns
Q
rr
Reverse Recovery Charge
dI/dt=100A/s
-
15
-
nC
2/7
AP4563GM
AP4563GM
P-CH Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ. Max. Units
BV
DSS
Drain-Source Breakdown Voltage
V
GS
=0V, I
D
=-250uA
-40
-
-
V
B
V
DSS
/T
j
Breakdown Voltage Temperature Coefficient
Reference to 25
,I
D
=-1mA
-
-0.03
-
V/
R
DS(ON)
Static Drain-Source On-Resistance
2
V
GS
=-10V, I
D
=-6A
-
-
36
m
V
GS
=-4.5V, I
D
=-4A
-
-
48
m
V
GS(th)
Gate Threshold Voltage
V
DS
=V
GS
, I
D
=-250uA
-1
-
-3
V
g
fs
Forward Transconductance
V
DS
=-10V, I
D
=-6A
-
10
-
S
I
DSS
Drain-Source Leakage Current (T
j
=25
o
C)
V
DS
=-40V, V
GS
=0V
-
-
-1
uA
Drain-Source Leakage Current (T
j
=70
o
C)
V
DS
=-32V, V
GS
=0V
-
-
-25
uA
I
GSS
Gate-Source Leakage
V
GS
=20V
-
-
100
nA
Q
g
Total Gate Charge
2
I
D
=-6A
-
20
32
nC
Q
gs
Gate-Source Charge
V
DS
=-30V
-
4
-
nC
Q
gd
Gate-Drain ("Miller") Charge
V
GS
=-4.5V
-
11
-
nC
t
d(on)
Turn-on Delay Time
2
V
DS
=-20V
-
12
-
ns
t
r
Rise Time
I
D
=-1A
-
6
-
ns
t
d(off)
Turn-off Delay Time
R
G
=3.3
,V
GS
=-10V
-
68
-
ns
t
f
Fall Time
R
D
=20
-
36
-
ns
C
iss
Input Capacitance
V
GS
=0V
-
1530 2500
pF
C
oss
Output Capacitance
V
DS
=-25V
-
250
-
pF
C
rss
Reverse Transfer Capacitance
f=1.0MHz
-
200
-
pF
R
g
Gate Resistance
f=1.0MHz
-
8
12
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min.
Typ. Max. Units
V
SD
Forward On Voltage
2
I
S
=-6A, V
GS
=0V
-
-
-1.3
V
t
rr
Reverse Recovery Time
I
S
=-6A, V
GS
=0V
-
29
-
ns
Q
rr
Reverse Recovery Charge
dI/dt=-100A/s
-
28
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in
2
copper pad of FR4 board , t <10sec ; 135
/W when mounted on min. copper pad.
3/7
N-Channel
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fig 5. Forward Characteristic of
Fig 6. Gate Threshold Voltage v.s.
Reverse Diode
Junction Temperature
4/7
AP4563GM
0
10
20
30
40
50
0
2
4
6
V
DS
, Drain-to-Source Voltage (V)
I
D
,
Dr
a
i
n C
u
r
r
e
nt
(A
)
T
A
=25
o
C
10V
7.0V
5.0V
4.5V
V
G
=3.0V
0
10
20
30
40
50
0
2
4
6
V
DS
, Drain-to-Source Voltage (V)
I
D
,
Dr
a
i
n C
u
r
r
e
nt
(A
)
T
A
= 150
o
C
10V
7.0V
5.0V
4.5V
V
G
=3.0V
20
40
60
80
2
4
6
8
10
V
GS
, Gate-to-Source Voltage (V)
R
DS
(
ON0
(m
)
I
D
=4A
T
A
=25
o
C
0.6
1.0
1.4
1.8
-50
0
50
100
150
T
j
, Junction Temperature (
o
C)
N
o
r
m
aliz
ed R
DS
(
ON)
I
D
=6A
V
G
=10V
0
2
4
6
0
0.2
0.4
0.6
0.8
1
1.2
V
SD
, Source-to-Drain Voltage (V)
I
S
(A
)
T
j
=25
o
C
T
j
=150
o
C
0.3
0.7
1.1
1.5
-50
0
50
100
150
T
j
, Junction Temperature (
o
C)
N
o
r
m
aliz
ed V
GS
(
t
h
)
(V
)
AP4563GM
N-Channel
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
5/7
Q
V
G
4.5V
Q
GS
Q
GD
Q
G
Charge
0
3
6
9
12
0
4
8
12
16
Q
G
, Total Gate Charge (nC)
V
GS
, G
a
te to S
o
u
r
ce Voltage (
V
)
I
D
= 6 A
V
DS
= 30 V
10
100
1000
10000
1
5
9
13
17
21
25
29
V
DS
, Drain-to-Source Voltage (V)
C (
p
F)
f=1.0MHz
C
iss
C
oss
C
rss
0.01
0.1
1
10
100
0.1
1
10
100
V
DS
, Drain-to-Source Voltage (V)
I
D
(A
)
T
A
=25
o
C
Single Pulse
100us
1ms
10ms
100ms
1s
10s
DC
0
10
20
30
40
50
0
2
4
6
8
V
GS
, Gate-to-Source Voltage (V)
I
D
,
Dr
a
i
n C
u
r
r
e
nt
(A
)
T
j
=150
o
C
T
j
=25
o
C
V
DS
=5V
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
10
100
t , Pulse Width (s)
N
o
r
m
aliz
ed T
h
er
m
a
l Res
pon
s
e
(
R
th
ja
)
P
DM
Duty factor = t/T
Peak T
j
= P
DM
x R
thja
+ T
a
R
thja
=135
o
C/W
t
T
0.02
0.01
0.05
0.1
0.2
Duty factor=0.5
Single Pulse